Kester Solder – 245 No-Clean Flux Solder,.031″,1lb. Spool

Kester 24-6337-8800 Alloy type: Sn63Pb37Diameter: 0.031’Flux %: 1.1%Weight: 1lbHighy reliable post-soldering residue Flux-Cored Solder Wire, No-Clean, Leaded, Sn63Pb37, 1.1%, 0.031′, 1lb Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency are comparable to that obtained with mildly activated rosin flux. 245 is classified as ROL0 per J-STD-004. 245 is Bellcore GR-78 compliant. Cleaning The 245 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent specifically designed to clean a no-clean flux is required to clean the residues.Kester 245 Flux-Core Solder Wire Comparison Table Click here. (1) Kester 24-6337-8800 Spool | 1 Pound per Spool | Sn63Pb37 1.1%/245 .031 1 LB SPL Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. 245 is classified as ROL0 per J-STD-004. 245 is Bellcore GR-78 compliant.

Features

• (1) Kester 24-6337-8800 Spool
• 1 Pound per Spool
• Alloy: Sn63Pb37
• 63% Tin
• 37% Lead