Spool Size: 1 lb. Core Flux: No Clean “275” Lead Free No-Clean Solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes.
Features
- 24-7068-7601 .031 275 wire solder
- Sn96.5/Ag3.0/Cu0.5
- Core size 58/2.2%
- No Clean Lead Free Wire Solder
- Melting Range: approximately 423-428o F, 217-330o C
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