Therm O Web Thermoweb Heat N Bond Medium Weight Iron On Fusible Interfacing White 20 inch x 36 inch 3337 (4-Pack)

$15.69

This fusible interfacing is used in sewing projects, which helps develop fine motor skills and practical life skills as part of a home economics or art elective.

Therm O Web Thermoweb Heat N Bond Medium Weight Iron On Fusible Interfacing White 20 inch x 36 inch 3337 (4-Pack)
Therm O Web Thermoweb Heat N Bond Medium Weight Iron On Fusible Interfacing White 20 inch x 36 inch 3337 (4-Pack)
$15.69

[wpforms id=”1190″ title=”true” description=”Request a call back”]

HeatnBond Medium Weight Non-Woven Fusible Interfacing is an extremely versatile product that you always want to keep on hand. It coordinates nicely with all types of fabrics and is commonly used for waistbands, button holes, plackets, collars, zippers and cuffs. HeatnBond Medium Weight Non-Woven Fusible is especially popular among quilters whose designs encompass a range of fabrics. With our HeatnBond Medium Weight Non-Woven Fusible interfacing you can rest assured there will be minimal shrinkage. Additionally, there is no grain line which means you can cut and apply it in any direction. HeatnBond Fusible Interfacing products have an adhesive application on one side which allows you to iron it directly onto the fabric, eliminating the need for basting and pinning. HeatnBond Fusible Interfacing makes constructing a garment or any other project so much easier because it provides stability and support that will eliminate the frustration of shifting materials

Features

  • 4 packages each are 20 x 36 inches
  • Non-Woven Fusible Interfacing
  • Commonly used for waistbands, button holes, plackets, collars, zippers and cuffs
  • Machine Washable/Dryable
  • 100% Polyester

Additional information

Weight 0.009 lbs
Dimensions 20.8 × 4.6 × 26.9 in

Reviews

There are no reviews yet.

Be the first to review “Therm O Web Thermoweb Heat N Bond Medium Weight Iron On Fusible Interfacing White 20 inch x 36 inch 3337 (4-Pack)”

Your email address will not be published. Required fields are marked *